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Brewer Science to Address High-Performance HB LED Chip Fabrication at SEMICON Taiwan

Manufacturers are seeking innovative materials, processes to address challenges

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By: DAVID SAVASTANO

Contributing Editor, Coatings World and Ink World, Coatings World and Ink World Magazine

With large-scale adoption of LEDs for general lighting applications on the horizon, HB LED manufacturers face several challenges, including the need to reduce costs steeply from fabrication of LED chip to system, reduce complexity of manufacturing processes, and improve scaling of processes for the fabrication of LEDs. Manufacturers seek innovative materials and processes to address several of these challenges.

Brewer Science exhibited and gave conference presentations at SEMICON Taiwan. Brewer Science highlighted product technologies for HB LED manufacturing for wafer protection, thin wafer handling, epitaxial layer transfer, trench filling and planarization. Held Sept. 5-7 at the TWTC Nangang Hall in Taipei, the event is the largest showcase of microelectronics manufacturing technology in Taiwan.

“Brewer Science has been delivering advanced technology solutions for the HB LED market for over seven years through close partnerships with leading LED manufacturers, and we are excited to present our cost-effective HB LED manufacturing solutions to the SEMICON Taiwan community,” said Ram Trichur, director of LED/Energy Devices Business.

Pathways to address critical issues in HB LED device manufacturing through innovative material, process, and equipment technology were discussed by Brewer Science at these conference presentations:

• “Smart LED Fabrication Materials as an Extendable, Lower-Cost-of-Ownership Alternative to Equipment-Based Process Solutions,” presented by Dr. Tony Flaim, chief technical officer.

• “High-Performance Materials for Improving Yield and Cost Efficiency of HB LED Chip Manufacturing,” was presented by Trichur.

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